Data Center Cooling Solutions for Colocation, Edge & Enterprise

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Description
Overview
Colocation, edge, and enterprise data centers require robust, energy-efficient cooling to sustain growing rack densities and mission-critical workloads. Building on our legacy in professional electronics and systems distribution, Shashi Enterprises now offers advanced data center cooling solutionsincluding direct-to-chip, immersion, and optimized air cooling. These technologies help reduce energy use, improve thermal performance, and ensure long-term reliability in modern data environments.
Direct-to-Chip Cooling
Direct-to-chip cooling uses custom-designed cold plates to extract heat directly from high-power components such as CPUs, GPUs, and ASICs. This method enables significantly higher thermal efficiency than air cooling and allows data centers to support greater rack density without thermal compromise. It is particularly suited for edge deployments, HPC clusters, and enterprise environments running AI or accelerated workloads.
Immersion Cooling
Immersion cooling involves submerging entire server systems in a non-conductive, thermally optimized liquid. This approach eliminates the need for airflow, fans, and traditional air-conditioning systems. It offers excellent efficiency, reduced noise, and minimal maintenance. Ideal for space-constrained environments, mobile data centers, and edge deployments, immersion cooling supports high thermal loads with minimal energy waste.
Air Cooling (Optimized Airflow)
Traditional air cooling remains a key part of many data centers. By optimizing airflow, through hot and cold aisle containment, improved rack layout, and targeted fan controls, significant gains can still be made in energy efficiency and equipment longevity. Shashi Enterprises supports customers in upgrading or retrofitting their existing infrastructure to achieve better cooling without a full system overhaul.